| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in reflow resistance and molding properties and hardly causing wire sweep and to provide a semiconductor device excellent in reflow resistance and having few voids sealed using this epoxy resin composition. SOLUTION: The epoxy resin composition for sealing comprises a dicyclopentadiene type epoxy resin as an epoxy resin, 0.01-10 wt.%, based on the total weight of the epoxy resin composition for sealing, of a polyether- modified silicone having an epoxy group in a side chain as a polyether-modified silicone and an amide wax as a wax. The semiconductor device is sealed using the above epoxy resin composition for sealing as an epoxy resin composition.
|
