发明名称 POLYAMIDE FOAM MOLDING PRODUCT
摘要 PROBLEM TO BE SOLVED: To obtain a polyamide foam molding product suitable for an industrial material such as an automobile part, an electronic and an electric parts, an industrial mechanical part, etc. SOLUTION: This polyamide foam molding product is characterized in that the molding product comprises a polyamide or a polyamide resin compounded with another resin and an apatite type compound containing an organic substance insoluble in a phenol solvent in an amount of 0.5-100 pts.wt. of the organic substance based on 100 pts.wt. of the apatite compound.
申请公布号 JP2001234058(A) 申请公布日期 2001.08.28
申请号 JP20000042918 申请日期 2000.02.21
申请人 ASAHI KASEI CORP 发明人 ARAMAKI MASAAKI
分类号 C08J9/00;C08G69/04;C08K3/32;C08L77/00;(IPC1-7):C08L77/00 主分类号 C08J9/00
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