| 摘要 |
PROBLEM TO BE SOLVED: To provide the subject resin composition excellent in transparency, optical uniformity, releasability and soldering resistance, and to provide an optical semiconductor device sealed with the cured product thereof. SOLUTION: This epoxy resin composition for optical semiconductor sealing use essentially comprises an epoxy resin, a curing agent, a curing promoter, and a releasant consisting of (A) a univalent saturated fatty acid with the >22C main chain, (B) a univalent saturated fatty acid with the >16C but <=22C main chain and/or (C) a univalent saturated fatty acid with the <=16C main chain. |
