发明名称 |
HIGH THERMAL CONDUCTIVE SPACER |
摘要 |
PROBLEM TO BE SOLVED: To provide a spacer which is remarkably excellent in heat dissipation property and flexibility. SOLUTION: In the high thermal conductive spacer, the spacer consists of silicone hardened material in which a hexagonal-system boron nitride coated magnesium and/or a calcium borate having an average grain size of 5-25 μm and an average roundness of 0.70 over are contained as a filler powder. |
申请公布号 |
JP2001230352(A) |
申请公布日期 |
2001.08.24 |
申请号 |
JP20000037978 |
申请日期 |
2000.02.16 |
申请人 |
DENKI KAGAKU KOGYO KK |
发明人 |
OTSUKA TETSUMI;KAWASAKI TAKU |
分类号 |
H01L23/373;C08K5/55;C08L83/04;C09K5/08 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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