发明名称 HIGH THERMAL CONDUCTIVE SPACER
摘要 PROBLEM TO BE SOLVED: To provide a spacer which is remarkably excellent in heat dissipation property and flexibility. SOLUTION: In the high thermal conductive spacer, the spacer consists of silicone hardened material in which a hexagonal-system boron nitride coated magnesium and/or a calcium borate having an average grain size of 5-25 μm and an average roundness of 0.70 over are contained as a filler powder.
申请公布号 JP2001230352(A) 申请公布日期 2001.08.24
申请号 JP20000037978 申请日期 2000.02.16
申请人 DENKI KAGAKU KOGYO KK 发明人 OTSUKA TETSUMI;KAWASAKI TAKU
分类号 H01L23/373;C08K5/55;C08L83/04;C09K5/08 主分类号 H01L23/373
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