发明名称 SCREENING DEVICE FOR SEMICONDUCTOR LASER CHIP
摘要 PROBLEM TO BE SOLVED: To efficiently manufacture semiconductor laser chips by applying screening to many semiconductor laser chips at the same time for the discrimination of propriety of the semiconductor laser chips. SOLUTION: Recessed parts (2) are provided in a single silicon substrate (1) on which semiconductor laser chips (3) are mounted, a photodiode (5) to monitor a luminous quantity of a light (11) emitted from each semiconductor laser chip (3) is provided in a wall face of each recessed part (2), power is supplied to each semiconductor laser chip (3) through a probe (9) to stimulate the chip (3) for a prescribed time resulting in stabilizing the characteristic of the semiconductor laser chip (3) and the propriety of each semiconductor laser chip (3) is discriminated on the basis of a change in a current after the power application.
申请公布号 JP2001230481(A) 申请公布日期 2001.08.24
申请号 JP20000042416 申请日期 2000.02.21
申请人 SHARP CORP 发明人 ICHIKAWA HIDEKI
分类号 H01S5/02;G01R31/26;H01L21/66;(IPC1-7):H01S5/02 主分类号 H01S5/02
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