| 摘要 |
PROBLEM TO BE SOLVED: To expand an application temperature range of a heat pump device. SOLUTION: A Peltier type heat pump (1) having a Peltier element (2) forming a heat absorbing segment (5) and a radiation part (6) under application of a DC current and supplying heat taken out by the heat absorbing part (5) to a heat radiating part is combined with a vapor compression type heat pump part (10) having an evaporator (18) and a condenser (14) and for supplying heat taken out of the evaporator (18) to the condenser (14), wherein the heat absorbing part (5) of the Peltier element (2) of the Peltier type heat pump (1) and the condenser (14) of a vapor compression type heat pump part (10) are arranged in such a way that heat can be transferred and then both heat pumps (1) and (10) are connected in a multi-stage manner.
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