| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a mounted substrate, which suppresses migration by a wiring material and can copy a pattern without troubles, and to provide mounted substrate obtained by the method. SOLUTION: Core base materials 12 are arranged on both sides of a bonding sheet 11, and resin sheets 13 are arranged outside the core base materials 12. Molds 14 are pressed from both sides of a laminate. By making the molds 14 abutted on both sides of the laminate, they are depressed. Thus, a projecting part is pressed to the resin sheet 12, and the resin sheet 12 is deformed by following the projection part. Consequently, a wiring pattern is copied to the resin sheet 12. When the mold 14 is pressed against to the resin sheet 12, the mold 14 is heated. Thus, the laminate is integrated at time same as that when the pattern in the projecting part of the mold 14 is transferred. In this way, a substrate body 15 having a groove 16 in a wiring pattern is obtained by pressing against the laminate by the mold 14.
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