| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a high reliability of connection points against environmental changes such as heat shock, etc., even when it is mounted on a low-cost light-weight resin board. SOLUTION: The invented semiconductor device 7 is one formed on an insulation substrate 2 having a circular shape changed from the conventional rectangular shape. Thus a semiconductor package for face-down bonding is provided wherein stresses concentrating on corner parts are eliminated so as to uniformly apply a stress corresponding to the range from the center. In a combination of a wiring board 20 for mounting the semiconductor device 7 with the insulation substrate 2 different in thermal expansion from the board 20, an especially superior reliability is obtained. |
