| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer prober with a chuck top conductive layer hardly flaked from a ceramic board. SOLUTION: In the wafer prober, the chuck top conductive layer is formed on the surface of the ceramic board. The surface roughness of at least a face where the chuck top layer is formed is Rmax=0.5 to 200μm, conforming to JIS R 0601.
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