摘要 |
PROBLEM TO BE SOLVED: To efficiently prevent a resin burr 15 or the like from attaching to a lead electrode 3 when a lead 5 of a sealed lead frame 4 provided while the lead is exposed to a package 2 is cut with a punch 9. SOLUTION: A sealed lead frame 4 is fed and set while the lead exposed surface of a package faces a punch 9 for cutting the lead. A lead 5 provided while being exposed to the package 2 is cut with the punch 9 from the lead exposed surface side of the package 2 so that a product 1 is formed while a lead electrode 3 is exposed to the package 2.
|