发明名称 METHOD OF PROCESSING LEAD OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To efficiently prevent a resin burr 15 or the like from attaching to a lead electrode 3 when a lead 5 of a sealed lead frame 4 provided while the lead is exposed to a package 2 is cut with a punch 9. SOLUTION: A sealed lead frame 4 is fed and set while the lead exposed surface of a package faces a punch 9 for cutting the lead. A lead 5 provided while being exposed to the package 2 is cut with the punch 9 from the lead exposed surface side of the package 2 so that a product 1 is formed while a lead electrode 3 is exposed to the package 2.
申请公布号 JP2001230359(A) 申请公布日期 2001.08.24
申请号 JP20000040392 申请日期 2000.02.18
申请人 TOWA CORP 发明人 KAWAMURA KOICHI
分类号 B21D28/00;H01L21/56;H01L23/50;(IPC1-7):H01L23/50 主分类号 B21D28/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利