发明名称 Resin composition
摘要 Disclosed herein is a resin composition which comprises (A) an ethylene-vinyl alcohol copolymer having an ethylene content of 20-70 mol %, (B) a polyamide resin, and (C) a hydrophobic plasticizer which satisfies the condition specified by equation (1) below, with the amounts of components (A), (B), and (C) being 55-97 parts by weight, 3-45 parts by weight, and 0.1-30 parts by weight, respectively, on the basis of 100 parts by weight of the total amount of components (A) and (B). <paragraph lvl="0"><in-line-formula>15<={CH(A)}½+SP(C)<=22 (1) </in-line-formula>where CH(A) denotes the ethylene content (mol %) in the ethylene-vinyl alcohol copolymer as component (A), and SP(C) denotes the solubility parameter of the hydrophobic plasticizer as component (C), which is calculated from Fedors equation. The resin composition can be formed into film or sheet superior in gas barrier properties readily by heat stretching without cracking and local thickness variation.
申请公布号 US2001016613(A1) 申请公布日期 2001.08.23
申请号 US20010828152 申请日期 2001.04.09
申请人 KURARAY, CO., LTD. 发明人 SHIMO HIROYUKI;HATA NOBUHIRO
分类号 C08K5/00;C08L23/08;C08L29/04;C08L77/00;(IPC1-7):C08L63/00 主分类号 C08K5/00
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