发明名称 |
Process for forming cone shaped solder for chip interconnection |
摘要 |
A method of forming non-spherically shaped solder interconnects, preferably conical, for attachment of electronic components in an electronic module. Preferably, the solder interconnects of the present invention are cone shaped and comprise of depositing a first solder followed by a second solder having a lower reflow temperature than the first solder. Warm placement of the electronic component at a somewhat elevated temperature than room temperature but less than the solder reflow temperature reduces the force required during placement of a semiconductor chip to a substrate. After warm placement, reflow of the module occurs at the lower reflow temperature of the second solder. The conical shape of the solder interconnects are formed by a heated coining die which may also coin a portion of the interconnects with flat surfaces for stand-offs. The ability of the cone shaped solder interconnects to meet the opposing surface of a chip or substrate at different heights accommodates the camber typically associated with chip and substrate surfaces. |
申请公布号 |
US2001015495(A1) |
申请公布日期 |
2001.08.23 |
申请号 |
US20010753819 |
申请日期 |
2001.01.03 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BROFMAN PETER J.;FAROOQ SHAJI;KNICKERBOCKER JOHN U.;LANGENTHAL SCOTT I.;RAY SUDIPTA K.;STALTER KATHLEEN A. |
分类号 |
B23K1/00;H01L21/60;H01L23/48;H01L23/485;H05K3/24;H05K3/30;H05K3/34;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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