METHODS AND APPARATUS FOR A VERTICALLY-INTEGRATED SENSOR STRUCTURE

摘要

A vertically integrated sensor structure (10) includes a sensor device (50) having a sensing element (54) formed thereon. The sensor device (50) is bonded directly to a control device (42), which itself is bonded to a mounting area (13) of a package (12). The sensing element (54) is electrically coupled to the control circuitry (46), which includes control circuitry (46) configured to receive input signals from the sensor device (50).