发明名称 PCB TO METALLIC GROUND CONNECTION METHOD
摘要 A method (100) for providing an electrical ground connection between a printed circuit board (700) and a metallic substrate (200) comprises the steps of: (i) providing an aperture (204) in the substrate (200); (ii) forming a ground plug (302) out of a metallic blank (300); (iii) inserting the ground plug (300) into the aperture in the substrate (200); (iv) compressing the ground plug (302) into the aperture (204) in the substrate (200); (v) placing the printed circuit board (700) onto the substrate (200); and (vi) applying solder into the aperture in the printed circuit board (700) and onto the ground plug (302). The steps of forming (104), inserting (106), and compressing (108) are carried out in a single punching operation (120). The method (100) efficiently provides a high quality electrical ground connection and avoids any need for sophisticated machinery.
申请公布号 EP1092248(A4) 申请公布日期 2001.08.22
申请号 EP19990912421 申请日期 1999.03.11
申请人 OSRAM SYLVANIA INC. 发明人 DOIKAS, PETER;GEIS, DAVID;MERWIN, JEFFREY, D.
分类号 H01R12/04;H01R43/02;H05K1/02;H05K1/11;H05K3/00;H05K3/40;H05K3/44;(IPC1-7):H01R9/00;H01L23/498;H01L21/48;H05K3/36;B21K1/62 主分类号 H01R12/04
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