| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in flame retardance, heat and moisture resistance and advantageously used for sealing semiconductors, laminated sheets, electrical insulation, etc. SOLUTION: This curable resin composition comprises the following components (A) and (B). component (A): an epoxy resin and component (B): a phenol compound represented by the following general formula (1) [wherein R1 and R2 denote each hydrogen atom or a 1-4C alkyl group; R3 denotes amino group, a 1-4C alkyl group, phenyl group, vinyl group or the like; and m is a number of 1 or 2].</p> |
