发明名称 REINFORCED POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a reinforced polyamide resin composition which is suitable in industrial materials such as automobile components, electronic and electric parts, an industrial machine components, and the molded products to be obtained from which have low warpage and excel in rigidity, strength, and heat resistance, and also durability of antifreeze resistance and resistance to vibrational fatigue. SOLUTION: This reinforced polyamide resin composition comprises a polyamide composite material composed of (A) a polyamide and (B) an apatite compound containing a phenolic solvent-insoluble organic substance in an amount of the organic substance of 0.5-100 pts.wt. based on 100 pts.wt. apatite compound or a polyamide resin composite material obtained by mixing the polyamide composite material with other resins, and (C) an inorganic filler.
申请公布号 JP2001226579(A) 申请公布日期 2001.08.21
申请号 JP20000041534 申请日期 2000.02.18
申请人 ASAHI KASEI CORP 发明人 ARAMAKI MASAAKI
分类号 C08G69/04;C08G69/28;C08K3/00;C08K3/32;C08K7/18;C08L77/00;(IPC1-7):C08L77/00 主分类号 C08G69/04
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