发明名称 Use of tapered shadow clamp ring to provide improved physical vapor deposition system
摘要 A method and apparatus is provided for clamping and shielding the edge of a substrate useful in electronic device fabrication. A shadow ring is formed by an inward radial extension of the top surface of a generally annular shaped clamp ring. The shadow ring portion overhangs but does not contact the top surface of a substrate being processed. A smoothly tapered substrate contact surface extending from the outer diametrical extent of the shadow ring bottom surface to the bottom surface of the clamp ring is sized and adapted to engage the outer edge of a substrate. The substrate contact surface aligns the clamp ring to a substrate support member and a substrate to the substrate support member and the clamp ring as the substrate is lifted vertically.
申请公布号 US6277198(B1) 申请公布日期 2001.08.21
申请号 US19990326395 申请日期 1999.06.04
申请人 APPLIED MATERIALS, INC. 发明人 YAO TSE-YONG;THOMPSON ALLEN;DING PEIJUN;HONG RICHARD
分类号 C23C14/50;C23C16/458;H01L21/205;H01L21/68;H01L21/687;(IPC1-7):B05C13/00;B05C13/02;B05C21/00 主分类号 C23C14/50
代理机构 代理人
主权项
地址