发明名称 METHOD OF THERMOCOMPRESSION BONDING OF WOVEN LABEL, AND HEAT-RESISTANT SELF-ADHESIVE LAYOUT SHEET USABLE THEREFOR
摘要 PROBLEM TO BE SOLVED: To omit the labor for manually arranging a heat-cut woven label on a layout sheet when carrying out the thermocompression bonding of the woven label on a uniform with a hot melt adhesive, and further to prevent a slipage and error caused when arranging the woven label in the layout. SOLUTION: A heat-resistant self-adhesive layout sheet A is formed by laminating a self-adhesive 2 on a transparent or translucent heat-resistant sheet 3 composed of a polyimide resin having a heat resistance higher than the heat- pen temperature of a heat-cutting machine, and the woven label 1 is placed and fixed thereon. The woven label 1 fixed to the layout sheet A is directly heat-cut by a heat-cutting machine, and the heat-cut woven label 1 in a label shape is subjected to the thermocompression bonding to a uniform 6 while being fixed on the heat-resistant adhesive layout sheet A so as to be stuck by the hot-melt adhesive 1a. Thereafter, the heat-resistant adhesive layout sheet A is removed therefrom.
申请公布号 JP2001226646(A) 申请公布日期 2001.08.21
申请号 JP20000281473 申请日期 2000.09.18
申请人 BANDO CHEM IND LTD 发明人 HAYASHI TORU;TAKADA NORIO
分类号 C09J7/02;C09J5/06;G09F3/10;(IPC1-7):C09J5/06 主分类号 C09J7/02
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