| 摘要 |
In the surface of a lower die 104 in a resin sealing mold, a region where an external leads 18 of a lead frame 12 and its peripheral regions having a width of 0.1 mm are mirror-finished to form a mirror-face region 22. The other region than the mirror-face region is subjected to discharging processing to form a satin-finished region 24. The resin-sealing mold having such a structure permits a package to be smoothly released and prevents resin from remaining.
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