发明名称 |
Chemical mechanical polishing endpoint process control |
摘要 |
Determination of an endpoint for removing a film from a wafer, by determining a first reference point removal time indicating when a breakthrough of the film has occurred, determining a second reference point removal time indicating when the film has been polished almost to completion, determining an additional removal time indicating an overpolishing interval, and adding the second reference point removal time with the additional removal time to get a total removal time to the endpoint.
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申请公布号 |
US6276987(B1) |
申请公布日期 |
2001.08.21 |
申请号 |
US19980129103 |
申请日期 |
1998.08.04 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LI LEPING;GILHOOLY JAMES A.;MORGAN, III CLIFFORD O.;WEI CONG |
分类号 |
B24B37/04;(IPC1-7):B24B49/00;B24B51/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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