CMP METHOD AND APPARATUS FOR PLANARIZATION

摘要

PURPOSE: A CMP(Chemical Mechanical Polishing) method and apparatus for planarization is provided to secure a stability of the CMP by completely preventing a slurry cohesion and deposition. CONSTITUTION: A holder(22) keeps to hold a wafer(30) and get circulated under the CMP method. A circulating unit(21) on which a grinder(21b) contacting the surface of the wafer is mounted get circulated to the opposite direction of the holder(22). A slurry supply unit(10) provides slurry which is mixed with an abradant to the surface of the wafer(30) by transferring the stored slurry to the circulating unit(21) through a pipe. A gas occurrence unit(14) provides an addition which keeps a gas state or a bubble state to the surface of the wafer(30) by transferring the addition to the circulating unit(21) through the pipe.