| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor hardly causing mold stains and excellent in mold release properties, humidity resistance and solder crack resistance. SOLUTION: The epoxy resin composition for sealing a semiconductor comprises, as essential ingredients, (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) urethanized products of an oxidized microcrystalline wax and of an oxidized polyethylene wax.
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