发明名称 PHOTO- AND HEAT-RESPONSIVE EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a photo- and heat-responsive epoxy resin composition in which a new absorption band appears with light, the absorption band is stable at 40 deg.C and disappears with heat. SOLUTION: This photo- and heat-responsive epoxy resin composition is characterized in that the photo- and heat-responsive epoxy resin composition comprises an epoxy compound and a curing agent for the epoxy compound, the above curing agent contains p-phenylenediamine or 1,5-naphthalenediamine, the p-phenylenediamine is contained in an amount of 1-50 mol% based on the curing agent and the 1,5-naphthalenediamine is contained in an amount of 1-100 mol% based on the curing agent.
申请公布号 JP2001226459(A) 申请公布日期 2001.08.21
申请号 JP20000038192 申请日期 2000.02.10
申请人 HITACHI LTD 发明人 AKATSUKA MASAKI;TAKEZAWA YOSHITAKA;CHRISTOPHER FAREN;ITO YUZO
分类号 C09K9/02;C08G59/50;C08L63/00;(IPC1-7):C08G59/50 主分类号 C09K9/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利