发明名称 |
Method for making partial full-wafer pattern for charged particle beam lithography |
摘要 |
Disclosed is a method for making a partial full-wafer pattern for charged particle beam lithography based on circuit design data. This method has the steps of: conducting the interlayer operation between the circuit design data of a pattern of lithographed layer and the circuit design data of a pattern of base layer underlying the lithographed layer to extract a product-set pattern; and making data of partial full-wafer pattern by setting the product-set pattern to be a target region of partial full-wafer pattern.
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申请公布号 |
US6277530(B1) |
申请公布日期 |
2001.08.21 |
申请号 |
US19990417099 |
申请日期 |
1999.10.13 |
申请人 |
NEC CORPORATION |
发明人 |
YAMADA YASUHISA |
分类号 |
H01L21/027;G03F7/20;H01J37/302;H01J37/317;H01L21/46;(IPC1-7):G03F9/00 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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