| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing semiconductors excellent in curability, fluidity and shelf life. SOLUTION: This epoxy resin composition is characterized in that the epoxy resin composition comprises (A) an epoxy resin containing a crystalline epoxy resin having 70-150 deg.C melting point in an amount of 30-100 wt.% in the whole epoxy resin, (B) a phenol resin, (C) an inorganic filler and (D) two more kinds of curing accelerators and the epoxy resin composition has 100-170 deg.C curing exothermic peak temperature, 5-50 deg.C difference in the peak temperatures, 40-150 deg.C starting temperature of curing heat generation and 10-60 deg.C difference of the peak starting temperatures.
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