发明名称 FILM-FORMING COMPOSITION AND INSULATING FILM
摘要 PURPOSE: Provided are a film-forming composition comprising a heat-curable polyarylene-ether-based polymer which is excellent in heat resistance, low dielectric properties and cracking resistance and which can be improved in solvent resistance, physical heat resistance and mechanical properties, and an insulating-film-forming material prepared from the composition. CONSTITUTION: The film-forming composition comprises a polymer having repeating structural units each represented by formula(1) and also having alkyl groups in the structural unit: (in the formula, R1 is are each the same or different alkyl group; a-d are each the same or different and have an integer of 0-4; and X is a bivalent organic group having 1-3 aromatic rings).
申请公布号 KR20010078184(A) 申请公布日期 2001.08.20
申请号 KR20010004491 申请日期 2001.01.31
申请人 JSR CORPORATION 发明人 NISHIKAWA MICHINORI;OKADA TAKASHI;YAMADA KINJI
分类号 C09D5/25;C08G65/40;C08J5/18;C08L71/00;H01B3/30;H05K3/46;(IPC1-7):C09D5/25 主分类号 C09D5/25
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