发明名称 |
METHOD FOR DOPING METALLIC CONNECTING WIRE |
摘要 |
<p>A method is disclosed for on-line doping of metallic connecting wire for use in integrated circuits. The method comprises the steps of: providing a bonding apparatus (70) comprising a bonding tool (40), said bonding tool having a tip (44) through which a capillary (42) runs, such that metallic connecting wire (20) may be fed through said tip (44); extending an end of the connecting wire (20) a predetermined length beyond the tip (44) of said bonding tool (40); and forming a doped area on the end of said wire by: bringing the end of said wire into contact with dopant material (52), and applying predetermined amounts of pressure, heat, and ultrasonic vibration to said end of the wire (20) for a predetermined amount of time.</p> |
申请公布号 |
EP0953207(B1) |
申请公布日期 |
2001.08.16 |
申请号 |
EP19970950330 |
申请日期 |
1997.12.24 |
申请人 |
FORD MOTOR COMPANY;FORD MOTOR COMPANY LIMITED |
发明人 |
PHAM, CUONG, VAN;BAKER, JAY, DEAVIS;NUNO, ROSE, LYNDA |
分类号 |
H01L21/60;B23K20/00;H01L21/607;(IPC1-7):H01L21/607;H01L21/603 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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