发明名称 |
PRINTED-CIRCUIT BOARD, MULTILAYER PRINTED-CIRCUIT BOARD AND METHOD OF MANUFACTURE THEREOF |
摘要 |
<p>Metallic conductors (14) are filled into via holes of a printed circuit board (30), and the conductors are covered with diffusing metal (16) on one end. The ends of the conductors are pressed against conducting circuits (51, 52) on another circuit board for thermocompression bonding. As a result, the metal on the ends of the metallic conductors diffuses into the metal of conductor circuits (51, 52) and forms alloy layers in the interface. This increases the reliability of electrical connections between layers.</p> |
申请公布号 |
WO0160136(A1) |
申请公布日期 |
2001.08.16 |
申请号 |
WO2000JP08103 |
申请日期 |
2000.11.16 |
申请人 |
IBIDEN CO., LTD.;ENOMOTO, RYO;TAMAKI, MASANORI |
发明人 |
ENOMOTO, RYO;TAMAKI, MASANORI |
分类号 |
H05K1/11;H05K3/32;H05K3/40;H05K3/42;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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