METHOD FOR MANUFACTURING PRINTED CIRCUIT MULTILAYER SUBSTRATE

摘要

PURPOSE: A method for manufacturing a printed circuit multilayer substrate is provided to simplify a process, minimize a number of process, easily form an electrode pattern by preventing increase in thickness of a coating layer and preventing decrease in reliability by optimizing an outer layer circuit. CONSTITUTION: Electrode patterns(100) are formed on a plurality of CCL(110). A through hole(140) is formed on a radiation plate(130) in advance. An insulating layer(120) is interposed on the radiation plate(130). Accordingly, center of the electrode patterns and the through hole(140) are matched. The insulating layer is filled in the through hole and the electrode patterns. Other side electrode patterns are formed one side of the electrode patterns and a via-hole is formed by piercing the radiation plate. A coating layer(170) is formed on an inside of the via-hole to electrically connect the electrode patterns. The insulating layer filled in the through hole on which the coating layer is formed is exposed to insulate the coating layer. An insulating part(180) on one side of the coating layer is formed by an etching process.