发明名称 ADHESIVE COMPOSITION, ADHESIVE FILM AND PRINTING WIRING BOARD FOR MOUNTING SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To provide a film-type adhesive showing a sufficient flow property and strength and a moderate tack. SOLUTION: The adhesive composition essentially comprising a mixture of two resins A and B showing phase reparation at stage B stage, is used. Here, the resin A has a weight average molecular weight of <=10,000 at an uncured state and is discontinuously dispersed inside as a dispersion phase at stage B, while the resin B has a weight average molecular weight of >=100,000 at an uncured state and exists continuously as a continuous phase at stage B. The volume ratio of the dispersion phase to the continuous phase at stage B state is 1:(0.5-5).
申请公布号 JP2001220571(A) 申请公布日期 2001.08.14
申请号 JP20000365185 申请日期 2000.11.30
申请人 HITACHI CHEM CO LTD 发明人 INADA TEIICHI;TANAKA HIROKO;IWAKURA TETSUO;SHIMADA YASUSHI
分类号 C09J7/02;C09J119/00;C09J163/00;C09J201/00;(IPC1-7):C09J201/00 主分类号 C09J7/02
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