发明名称 FILM DEPOSITION SYSTEM
摘要 PROBLEM TO BE SOLVED: To prevent the increase of the temperature of a substrate in emergency. SOLUTION: In emergency, in the case a substrate is included in the heating region of a treating chamber 14A, this substrate is carried to an adjacent corner chamber 22A or 22B. Alternatively, in the case a substrate is included in the heating region of a treating chamber 14B, this substrate is carried to an adjacent corner chamber 22B or a treating chamber 14C.
申请公布号 JP2001220673(A) 申请公布日期 2001.08.14
申请号 JP20000025164 申请日期 2000.02.02
申请人 ANELVA CORP 发明人 NOZAWA NAOYUKI;NAGAI MOTOMASA;WATANABE NAOKI;HORIGUCHI AOSHI
分类号 C23C14/54;G11B5/85;(IPC1-7):C23C14/54 主分类号 C23C14/54
代理机构 代理人
主权项
地址