Piping system for etch equipment

摘要

The present invention discloses a piping system for etch equipment including an exhaust gas tube connected with an etching chamber for conveying exhaust gas out of the chamber. A cooling gas tube connected to the etching chamber allows cooling gas to flow around a back side of the wafer placed in the chamber for cooling the wafer's temperature. A cooling gas bypass tube connected between the cooling gas tube and the exhaust gas tube is used for regulating a gas flow in the cooling gas tube. Moreover, a plurality of heaters are set out of conjunctions of the cooling gas tube and cooling gas bypass tube with the exhaust gas tube so as to retard particle accumulation in the conjunctions of these tubes.