发明名称 WATER SOLUBLE OR WATER DISPERSIBLE HOT MELT ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a water soluble or water dispersible hot melt adhesive composition which is soluble in water, excellent in water dipersibility, low in the melt viscosity and excellent in the adhesiveness, moisture resistance and thermal stability. SOLUTION: The water soluble or water dispersible hot melt adhesive composition contains 100 pts.wt. of (a) a poly(vinyl alcohol)-based resin which has a degree of polymerization of 350 or less and a degree of saponification of 80% or less; 5-100 pts.wt. of (b) mannitol; and 5-100 pts.wt. of (c) a polypropylene glycol which has an average molecular weight of 230-450 and a hydroxy value of 300 or more.
申请公布号 JP2001220563(A) 申请公布日期 2001.08.14
申请号 JP20000032077 申请日期 2000.02.09
申请人 SEKISUI CHEM CO LTD 发明人 YAMAGUCHI MASASHI
分类号 C09J129/04;C09J5/06;C09J11/06;(IPC1-7):C09J129/04 主分类号 C09J129/04
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