| 摘要 |
PURPOSE: A method for selecting an optimal lot for performing etching process is provided to make critical dimensions of a circuit uniform to increase overall yield of manufacturing step. CONSTITUTION: The method for selecting the optimal lot for performing etching process includes following steps. At first, a plurality of AIDICD data are transmitted through a network of lots on which a photo operation is performed and are stored with lot ID, photo apparatus ID, and photo step ID temporarily(S10). Then, a plurality of ACICD data are transmitted through the network and are stored with lot ID on which an etching operation is performed by a host server, etching apparatus ID, etching step ID temporarily(S20). At third, the first and second data are combined to calculate skew values(S30). Then, etching variation is calculated by the skew value from the skew values stored at the third step(S50). At fifth, a plurality of etcher values are calculated from the skew values(S60). At sixth, a plurality of etcher values, a plurality of AIDICD and ACICD target values are applied to a predetermined equation to find optimal lot(S80). At last, the lot is inserted to the etcher.
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