HEAT DISSIPATING MATERIAL, AND SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE USING IT

摘要

PROBLEM TO BE SOLVED: To prevent removal of the connecting part of a semiconductor chip or a semiconductor device from a wiring board. SOLUTION: The heat dissipating material provided in a semiconductor device or an electronic device in order to dissipate heat generated therefrom to the outside comprises a heat dissipating member having excellent thermal conductivity, and a material (elastomer) for relaxing thermal stress occurring between the heat dissipating member and the semiconductor device or the electronic device and at the bonding part thereof.