| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering method whereby the heat influence on PC boards or electronic components during soldering works can be greatly reduced by a simple work. SOLUTION: Using a radiation mesh (10) having a plurality of small rings which are made of a high-heat conductivity material and arranged on the same plane where the adjacent small rings are mutually swingably connected, electronic components (21, 22) are mounted on a printed board (20) and covered with the radiation mesh so as to contact the electronic components and/or printed board, and then soldering is performed with molten solder contacted to the printed board and/or electronic components.
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