| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a printed wiring board which can mount a module substrate, having electronic components such as a semiconductor element, a chip component, and a hybrid IC mounted on both the top and reverse surfaces of a printed wiring board to high density, on a mother board in contact. SOLUTION: The manufacturing method is provided which can mount the module substrate on the mother board after mounting electronic components on a surface external-layer circuit conductor of an exposed upper substrate, and an internal-layer circuit conductor at the bottom of an inverted recess type opening hole on the reverse surface of a lower substrate as a printed wiring board which has an electronic component storage part in inverted recessed structure opened on the lower side of the printed wiring board.
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