| 摘要 |
PROBLEM TO BE SOLVED: To provide a mount structure of a chip semiconductor device which is free of wire breakage at the time of mounting due to heat stress, superior in economy, and causes no environmental pollution. SOLUTION: This chip type semiconductor device has its terminal electrodes mounted on a pattern electrode on a wiring board. The surface roughness of the terminal electrodes at least on the mount surface side is <=0.1μm, and the surface roughness of the pattern electrode at the terminal electrode mounted part is <=0.1μm.
|
