| 摘要 |
PROBLEM TO BE SOLVED: To provide copper foil which is easily machined by a laser and suitably has a small-diameter interlayer connection hole formed and its manufacturing method by improving the top surface of the copper foil when a printed circuit board is manufactured. SOLUTION: This copper foil with superior laser boring property is provided with a layer containing at least one kind among indium, tin, cobalt, zinc, cobalt alloy, and nickel alloy, on a laser-light irradiated surface. |
