| 摘要 |
<p>A high speed, high density electrical connector. The disclosed embodiments are principally configured for carrying differential signals, though other configurations are discussed. For differential signals, the signal conductors (218) are arranged in pairs and shield strips (312 A-E) run parallel to each pair. The connector is manufactured with wafer assemblies (205). Separate signal (210, 212) and shield wafers (214) are formed. The signal wafers interlock to position signal conductors in pairs and then the shield wafers are attached. A cap (216) is placed on the signal wafer assembly to protect contact elements.</p> |
