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发明名称
METHOD AND APPARATUS FOR PLACING SOLDER BALLS ON A SUBSTRATE
摘要
申请公布号
EP1121218(A1)
申请公布日期
2001.08.08
申请号
EP19990951764
申请日期
1999.10.05
申请人
SPEEDLINE TECHNOLOGIES, INC.
发明人
FREEMAN, GARY;NOWAK, THOMAS, JR.;PURCELL, THOMAS;MIRABITO, A., JASON;SULLIVAN, THOMAS, M.
分类号
B23K1/00;B23K3/00;B23K3/06;B23K101/40;H01L21/48;H01L21/60;H01L23/12;H05K3/34;(IPC1-7):B23K3/06
主分类号
B23K1/00
代理机构
代理人
主权项
地址
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