发明名称 WORKING FLUID COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide working fluid cooling device for cooling working fluid leaking in a rotational cylinder in a chuck device under a condition free from the action of a back pressure. SOLUTION: In the working fluid cooling device cooling the leaking working fluid, which leaks inside the rotary cylinder 102 of the chuck device 100 and is collected into a tank 112 via a collecting pipe 111, a through-hole 3a for inserting the collecting pipe 11 is arranged in the center, and a cooling body 2 provided with a coolant flow passage 4 for passing the coolant flow through and a coolant feeding means 8 feeding the coolant to the coolant flow passage 4 for circulating it are arranged. By means of the coolant fed to the coolant flow passage 4, the cooling body 2 is cooled, and the leaking working fluid collected via the inside of the collecting pipe 111 is cooled down by means of the cooling body 2.
申请公布号 JP2001212736(A) 申请公布日期 2001.08.07
申请号 JP20000028958 申请日期 2000.02.01
申请人 MORI SEIKI CO LTD 发明人 NAKAMURA KENJI
分类号 B23Q11/12;(IPC1-7):B23Q11/12 主分类号 B23Q11/12
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