发明名称 TEST COUPON IN PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To shorten an overhang distance relative to a printed wiring board. SOLUTION: At both ends of a coupon region E2, first and second through holes 14, 15, 31, and 32 are provided. Between the first and second through holes 14, 15, 31, and 32, conductor patterns 24-29 are extended for electrical connection of through holes 14a, 15a, 31a, and 32a. The extension direction of the conductor patterns 24-29 is identical with the side-by-side provision direction of the through holes 14a, 15a, 31a, and 32a. Thus, the test coupon 12 is extended along the edge part of a printed wiring board 11, not proportional to the number of through holes.
申请公布号 JP2000138435(A) 申请公布日期 2000.05.16
申请号 JP19980310592 申请日期 1998.10.30
申请人 IBIDEN CO LTD 发明人 KAWAGUCHI KATSUO
分类号 H05K1/11;G01R27/00;G01R31/02;G01R31/28;H05K1/02;H05K3/00;(IPC1-7):H05K1/11 主分类号 H05K1/11
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