| 摘要 |
A method and devices for a current dump circuit that includes a first termination device, a second termination device, and a current dump device. The first termination device resides outside the die of an IC. One end of the first termination device is operatively connected to a first voltage regulator. Another end of the first termination is device operatively connected to a signal line of the IC. The second termination device resides on a die of the IC. One end of the second termination device is operatively connected to a second voltage regulator. Another end of the second termination device is operatively connected to the signal line of the IC. The current dump device provides a path to remove any current flow between the first voltage regulator and the second voltage regulator.
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