发明名称 |
Radiocommunication module in the form of an electronic macro-component, corresponding interface structure and transfer method onto a motherboard |
摘要 |
Module for radiocommunication equipment intended to be transferred onto a motherboard and comprising components mounted on a printed circuit and ensuring at least one of the following functions: RF processing, numerical processing, and analog processing. It comprises a set of conductive elements distributed on the lower face of the said printed circuit, and embodied such that the said set of conductive elements constitutes at the same time: means for electromagnetic screening of the lower face of the printed circuit; electrical interconnection means, ensuring the passage of electrical signals toward and/or from the motherboard; and means for transfer of the radiocommunication module onto the motherboard; such that the radiocommunication module forms an electronic macro-component. |
申请公布号 |
AU3192201(A) |
申请公布日期 |
2001.08.07 |
申请号 |
AU20010031922 |
申请日期 |
2001.01.26 |
申请人 |
WAVECOM |
发明人 |
BACHIR KORDJANI;JACKY JOUAN |
分类号 |
H05K1/02;H05K1/14;H05K3/34;H05K3/36;H05K9/00 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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