发明名称 Heat management in wafer processing equipment using thermoelectric device
摘要 A semiconductor processing system and method, which uses heat energy typically wasted in most common semiconductor processing systems, to generate power. The present invention includes a heat management system, which uses the waste heat and/or the excess heat generated by a thermal-processing chamber, to generate a current from a first thermoelectric device. The current from the first thermoelectric device is then delivered to a second thermoelectric device. The second thermoelectric device, driven by the current from the first thermoelectric device, can be used to remove heat from a cooling chamber or else add heat to another processing chamber.
申请公布号 US6271459(B1) 申请公布日期 2001.08.07
申请号 US20000558522 申请日期 2000.04.26
申请人 WAFERMASTERS, INC. 发明人 YOO WOO SIK
分类号 H01L21/324;H01L21/02;H01L35/00;H01L35/16;H01L35/28;H01L35/32;H02N11/00;(IPC1-7):H01L35/00 主分类号 H01L21/324
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