PHOTOSENSITIVE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which attains resist formation by a photographic process with good pattern accuracy by development using an aqueous alkali solution and exhibits satisfactory heat resistance and flexibility by processing at a low temperature. SOLUTION: The photosensitive resin composition contains (a) an organopolysiloxane having an epoxy-containing organic group represented by formula 1, (b) a phenol novolak having at least one acryloyl or methacryloyl group, (c) a diluent comprising a photo-polyfunctional monomer or a polyfunctional monomer having photo- and thermo-functional groups or a diluent using those monomers in combination and (d) a photopolymerization initiator as essential components.