| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device which suppresses resin burrs on the backside of a lead frame and can ensure a stand-off height from the seal resin. SOLUTION: A semiconductor chip 15 is bonded onto a die pad 13 of a lead frame with inner leads 12 electrically connected to electrode pads of the semiconductor chip 15 through thin metal wires 16. The die pad 13, the semiconductor chip 15 and the inner lends are sealed with a seal resin 17, but the seal resin 17 does not exist at the backside of the inner leads 12. The backsides of the inner leads 12 project down below the backside of the seal resin 17 to form outer electrodes 18. Owing to the projecting outer electrodes 18, a stand-off height of the outer electrodes 18 is secured previously for bonding the outer electrodes 18 to electrodes of a mounting board and hence the outer electrodes 18 can be used as the outer terminals as they are. |
