发明名称 ASSEMBLED SUBSTRATE, CIRCUIT BOARD, AND METHOD OF MANUFACTURING CIRCUIT BOARD USING ASSEMBLED SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an assembled substrate for which the inspection or adjustment of a circuit board section is required in an assembled state, which can reduce the size of a circuit board and, at the same time, which can simplify the manufacturing process of the circuit board. SOLUTION: A terminal section 124 which is required for performing inspections, etc., on the first circuit section 112 of a first circuit board section 11 is provided on a second circuit board section 12. The circuit board is manufactured by cutting the first circuit board section 11 at boundaries after the inspections, etc., are carried out on the first circuit section 112. Since the terminal section 124 which is required for performing inspections, etc., on the first circuit section 112 is provided on a part other than the first circuit board section 11, an assembled substrate which can reduce the size of circuit board can be obtained. In addition, since terminal sections can be disconnected simultaneously from first circuit sections when this assembled substrate is divided into circuit boards, the need of a step of disconnecting the terminal sections from the first circuit sections and a step of confirming whether or not the disconnection is surely performed can be eliminated. Consequently, an assembled substrate which can make the circuit board easily manufacturable can be obtained.
申请公布号 JP2001210926(A) 申请公布日期 2001.08.03
申请号 JP20000015810 申请日期 2000.01.25
申请人 MURATA MFG CO LTD 发明人 KITAGUCHI HIDENORI
分类号 H05K1/11;H05K1/02;H05K3/00;(IPC1-7):H05K1/11 主分类号 H05K1/11
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