| 摘要 |
<p>PROBLEM TO BE SOLVED: To markedly improve patterns formed through etching in width uniformity by carrying out etching uniformly. SOLUTION: Water is applied on a substrate as an object of etching before application of etchant rotating the substrate for improving the surface of the substrate in wettability (S1). Then. etchant is applied on the surface of the substrate, so as not to dry out the surface of the substrate where water is applied in a step S1 (S2). Thereafter, the substrate is rinsed (cleaned) (S3) and dried out (S4).</p> |
